Dry transfer of graphene to dielectrics and flexible substrates using polyimide as a transparent and stable intermediate layer
| Autor: | Frederic Christian Wagner, Manuel Fernandez, Bin Zhu, Benedict Yorke Johnson, Tong Lai Chen, Theresa Chang, Valerio Pruneri, Arliguie Therese Francoise, Miriam Marchena, Robert Lee, Prantik Mazumder |
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| Rok vydání: | 2018 |
| Předmět: |
Materials science
Fabrication Graphene Mechanical Engineering 02 engineering and technology General Chemistry 010402 general chemistry 021001 nanoscience & nanotechnology Condensed Matter Physics 01 natural sciences 0104 chemical sciences law.invention Mechanics of Materials law General Materials Science Dry transfer Adhesive Graphite Composite material Thin film 0210 nano-technology FOIL method Polyimide |
| Zdroj: | 2D Materials. 5:035022 |
| ISSN: | 2053-1583 |
| DOI: | 10.1088/2053-1583/aac12d |
| Popis: | We demonstrate the direct transfer of graphene from Cu foil to rigid and flexible substrates, such as glass and PET, using as an intermediate layer a thin film of polyimide (PI) mixed with an aminosilane (3-aminopropyltrimethoxysilane) or only PI, respectively. While the dry removal of graphene by an adhesive has been previously demonstrated—being removed from graphite by scotch tape or from a Cu foil by thick epoxy (~20 µm) on Si—our work is the first step towards making a substrate ready for device fabrication using the polymer-free technique. Our approach leads to an article that is transparent, thermally stable—up to 350 °C—and free of polymer residues on the device side of the graphene, which is contrary to the case of the standard wet-transfer process using PMMA. Also, in addition to previous novelty, our technique is fast and easier by using current industrial technology—a hot press and a laminator—with Cu recycling by its mechanical peel-off; it provides high interfacial stability in aqueous media and it is not restricted to a specific material—polyimide and polyamic acids can be used. All the previous reasons demonstrate a feasible process that enables device fabrication. |
| Databáze: | OpenAIRE |
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