A Characterized Redistribution Layer Architecture for Advanced Packaging Technologies
| Autor: | Daisuke Kitayama, Miyuki Akazawa, Hiroyuki Sato, Masaya Tanaka, Kouji Sakamoto, Hiroshi Mawatari, Yumi Okazaki, Ryohhei Kasai, Hiroshi Kudo, Shouhei Yamada, Toshio Sasao, Susumu Tashiro, Naoki Oota, Satoru Kuramochi, Haruo Iida, Takamasa Takano, Mitsuhiro Takeda, Jyunichi Suyama |
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| Rok vydání: | 2016 |
| Předmět: |
010302 applied physics
Flexibility (engineering) Double layer (biology) Materials science Fabrication business.industry Transmission rate Dielectric 01 natural sciences 010309 optics 0103 physical sciences Hardware_INTEGRATEDCIRCUITS Interposer Electronic engineering Optoelectronics Redistribution layer business |
| Zdroj: | 2016 IEEE 66th Electronic Components and Technology Conference (ECTC). |
| Popis: | An enhanced redistribution layer architecture has been developed in which the Cu wires are directly covered with a double layer consisting of two types of dielectrics by using a semi-additive process. The double layer enhanced the thermal and electrical reliabilities of the Cu wires. Moreover, it enabled fabrication of a single-sided nine-level redistribution layer embedded with a fully stacked via. This greatly increased wiring layout flexibility and enhanced the transmission rate. Characterization of this architecture revealed that it has several advantages for advanced packaging technologies including a 2.5D interposer. |
| Databáze: | OpenAIRE |
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