Silane-Bridged Electroless Ni-Plating on Submicron Polymer Spheres
Autor: | Chee-Shan Chen, Wen-Chang Liaw, Kuan-Pin Chen, Po-Chen Huang |
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Rok vydání: | 2009 |
Předmět: | |
Zdroj: | Polymer Journal. 41:634-642 |
ISSN: | 1349-0540 0032-3896 |
DOI: | 10.1295/polymj.pj2008334 |
Popis: | The silane coupling agent (3-trimethoxysilyl propryl methacrylate) was used to functionalize the surface of submicron polymer spheres (sized 168–650 nm) for bridging the polymer core (polystyrene crosslinked with divinylbenzene) and the metal coating shell. The submicron polymer spheres were synthesized by emulsifier-free emulsion polymerization in the presence of NaOH. The metal shell was created by electroless plating. The performance of silane coupling agent, as the bondage between the core and the shell, was compared, in terms of thermal, mechanical and electrical properties, to that of polymer spheres functionalized with -COOH groups. The silane bridge provided more opportunities for binding with metal and the bondage is stable, leading to a denser and more uniform distribution of metal coating, as observed by FESEM studies. The silane bridge was proven to be more durable than the case of -COOH by ball mill tests. Besides bridging with the metal, neighboring silyl groups also form Si-O-Si 2-dimensional network by condensation between two Si-OHs, which further stabilized the bondage between the polymer core and the metal shell. |
Databáze: | OpenAIRE |
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