3-D Numerical and Experimental Investigations on Compression Molding in Multichip Embedded Wafer Level Packaging
| Autor: | Lin Ji, Tai Chong Chai, Xiaowu Zhang, Dexter Velez Sorono |
|---|---|
| Rok vydání: | 2013 |
| Předmět: |
Materials science
business.industry Numerical analysis Semiconductor device modeling Compression molding Mechanical engineering Computational fluid dynamics Flow pattern Industrial and Manufacturing Engineering Manufacturing cost Electronic Optical and Magnetic Materials Electronic engineering Wafer Electrical and Electronic Engineering business Wafer-level packaging ComputingMethodologies_COMPUTERGRAPHICS |
| Zdroj: | IEEE Transactions on Components, Packaging and Manufacturing Technology. 3:678-687 |
| ISSN: | 2156-3985 2156-3950 |
| DOI: | 10.1109/tcpmt.2012.2220141 |
| Popis: | This paper focuses on the 3-D numerical methodology development of wafer level compression molding. With its successful application in a two-die-package embedded wafer level encapsulation, flow patterns, velocity, and pressure distributions are compared for different die size and die thickness. The computed flow-induced forces indicate which zone has a high risk of die sliding. The simulated molten molding compound flow fronts are compared with actual molding short shot samples. The key advantage of this numerical study is that it helps detect the molding defects quickly and improve moldability problems efficiently, in order to reduce manufacturing cost and design cycle time. |
| Databáze: | OpenAIRE |
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