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Soldering provides a cost-effective means for attaching electronic packages to circuit boards using both small-and large-scale manufacturing processes. Soldering processes accommodate through-hole leaded components as well as surface-mounted packages. The versatility of soldering is attributed to the variety of available solder alloy compositions, substrate material methodologies, and different manufacturing processes. The technology of solder mounting components onto a circuit board is outlined. The general topics of solderability, solder compositions, substrate materials, and fluxes are discussed. An overview of soldering processes discusses schedule preheat, reflow, and cool-down parameters as well as specific manual and automated technologies. The topic of soldering defects is also discussed. |
