A Review on Mechanical Properties of SnAgCu/Cu Joint Using Laser Soldering

Autor:	Siti Rabiatull Aisha Idris, Nabila Tamar Jaya, Mahadzir Ishak
Rok vydání:	2018
Předmět:	Copper substrate Materials science Intermetallic chemistry.chemical_element Laser Copper law.invention chemistry law Soldering Composite material Joint (geology) Laser soldering Solder alloy
Zdroj:	The Advances in Joining Technology ISBN: 9789811090400
DOI:	10.1007/978-981-10-9041-7_8
Popis:	This paper focuses on publishing the review of mechanical properties at the interface between SnAgCu (SAC) solder and Copper substrate after laser soldering. This involved on basic principles of solder alloy and Copper diffusion mechanism. In addition, this paper also reviews laser solder effects towards mechanical properties of the solder joint. This paper approach on the review of the solder joint strength which regards to intermetallic compound type and thickness. The output of this paper is to create an understanding for the readers about variance of laser soldering parameters and its effect on the mechanical properties of the solder joint by including discussion from other research paper findings.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::c919ec8c9ba3ffac3d60937a240bebd2 https://doi.org/10.1007/978-981-10-9041-7_8 Zobrazit plný text záznamu