| Autor: |
Ram S. Viswanath, H.I. Rosten |
| Rok vydání: |
2002 |
| Předmět: |
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| Zdroj: |
1994 Proceedings. 44th Electronic Components and Technology Conference. |
| DOI: |
10.1109/ectc.1994.367556 |
| Popis: |
Large mono-chip packages show a trend of increasing power dissipation and power density: for example the maximum dissipation of the Pentium processor is 16 Watts compared to the 6 Watts of its 80486 predecessor. This poses challenges for equipment designers to provide satisfactory thermal environments for reliable package operation. This paper provides an example of a component manufacturer and a thermal-analysis software vendor working together to construct and validate a thermal model of first-level packaging of a die (the Pentium processor) that can be used by equipment designers concerned with second- and third-level packaging. It is proposed that this example might set a pattern for the future. > |
| Databáze: |
OpenAIRE |
| Externí odkaz: |
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