615 Interface crack propagation between submicron-thick polymer film and substrate due to creep

Autor:	Takashi Sumigawa, Takayuki Kitamura, Emi Kawai
Rok vydání:	2015
Předmět:	chemistry.chemical_classification Crack closure Materials science chemistry Creep Fracture mechanics Polymer Substrate (electronics) Composite material
Zdroj:	The Proceedings of Conference of Kansai Branch. :251-254
ISSN:	2424-2756
DOI:	10.1299/jsmekansai.2015.90.251
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::c8872ca8b4bdf33c38081ecdf826096c https://doi.org/10.1299/jsmekansai.2015.90.251 Zobrazit plný text záznamu