MACOM’s L-PIC™ (Laser Integrated PIC) Platform Using Self-Aligned Etch Facet Technology (SAEFT™) For Data Center Networks

Autor:	Richard Grzybowski, Arlen Martin
Rok vydání:	2017
Předmět:	Facet (geometry) Interconnection Silicon photonics business.industry Optical testing Computer science Laser law.invention law Hardware_INTEGRATEDCIRCUITS Electronic engineering Data center business Simulation Electronic circuit
Zdroj:	Advanced Photonics 2017 (IPR, NOMA, Sensors, Networks, SPPCom, PS).
DOI:	10.1364/networks.2017.new1b.4
Popis:	MACOM has addressed the DC Interconnect module model by developing a platform providing a solution minimizing module yield problems merged with a cost effective manufacturing approach to provide silicon photonic circuits with integrated lasers.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::c8565ef9e85ac74ead427b8fa2108b0f https://doi.org/10.1364/networks.2017.new1b.4 Zobrazit plný text záznamu