Bicomponent poly(ethylene)/poly(propylene) fiber bonding using dielectric inks
| Autor: | Fredrick William Gibson, William Maxwell Allen, Rachel Shifman, Zi Li, Mark M. Banaszak Holl, Nathan Ng, Wei Lu, Dandan Wang, Arman Ashraf, P. Takunda Chazovachii, Bradford G. Orr |
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| Rok vydání: | 2019 |
| Předmět: |
Materials science
02 engineering and technology Dielectric 010402 general chemistry 021001 nanoscience & nanotechnology 01 natural sciences 0104 chemical sciences law.invention chemistry.chemical_compound Colloid and Surface Chemistry chemistry Optical microscope law Propylene carbonate Dielectric loss Fiber Composite material 0210 nano-technology Dispersion (chemistry) Microwave Tensile testing |
| Zdroj: | Colloids and Surfaces A: Physicochemical and Engineering Aspects. 582:123868 |
| ISSN: | 0927-7757 |
| DOI: | 10.1016/j.colsurfa.2019.123868 |
| Popis: | A dielectric ink thermal processing method has been developed to bond bicomponent poly(ethylene)/poly(propylene) (bico-PE/PP) fibers that are commonly used to make nonwoven fabrics for a variety of applications including medical, hygiene, and filtration needs. Dielectric inks applied to the fibers offer a number of potential advantages over conventional calendar bonding including more efficient energy conversion, faster heating rates, heating directed to desired bond sites, facile patterning, the ability to function on materials with substantial amounts of loft, and avoidance of fiber damage induced by calendar roller contact. Poly(ethylene) and poly(propylene) do not efficiently convert microwave energy to heat on their own; therefore, propylene carbonate (PC) and glycerine carbonate (GC) were selected as ink candidates due to their large dipole moments and dielectric constants. The temperature-dependent dielectric constant and dielectric loss values of both carbonates were measured as well as their thermal responses to microwave energy at 2.45 GHz. The dispersion of each carbonate on bico-PE/PP fibers, including the application to nonwoven fabrics, was characterized by optical microscopy. The thermal response for ink loading as a function of microwave radiation exposure time was investigated. Tensile test results showed that the bonding strength of dielectric ink bonded samples was comparable with the bonding obtained using conventional calendar bonding. The results presented herein demonstrate that dielectric inks provide fast heating rates, excellent fiber bonding, and the ability for facile nonwoven patterning. |
| Databáze: | OpenAIRE |
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