Advanced Processing Sequences for Diamond Wire Sawn Silicon Substrates

Autor:	Patzig-Klein, S., Schumann, M., Dechant-Wagner, R., Xu, S., Zanger, L., Wu, J., Delahaye, F., Schweckendiek, J., Heeren, A., Nussbaumer, H.
Jazyk:	angličtina
Rok vydání:	2013
Předmět:	WAFER-BASED SILICON SOLAR CELLS AND MATERIALS TECHNOLOGY Manufacturing Issues and Processing
DOI:	10.4229/28theupvsec2013-2cv.4.32
Popis:	28th European Photovoltaic Solar Energy Conference and Exhibition; 1761-1764 The presented study provides a detailed insight into solar cell processing of diamond cut (FASW) silicon wafers. Fundamental investigations solidify the demand for matching adaptions of sawing, cleaning and texturing techniques. Basic evaluations are conducted by analysis of produced sawing marks, cleaning steps for as-cut silicon surfaces, texturing homogeneity and comparison of surface reflectance. The impact on solar cell performance is discussed and interpreted with respect to overall processing sequences.
Databáze:	OpenAIRE
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