Warpage of transfer-molded automotive power modules – experimental characterization, numerical simulation and optimization
Autor: | M Sprenger, M Krämer, E Tolyschew, M Steinau, D Renner, B Ottinger, J Franke |
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Rok vydání: | 2023 |
Zdroj: | 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE). |
Databáze: | OpenAIRE |
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