Fabrication of three-dimensional Cu/Ni multilayered microstructure by wet process

Autor:	Takahide Hasegawa, Susumu Arai, Norio Kaneko
Rok vydání:	2004
Předmět:	Fabrication Materials science Scanning electron microscope General Chemical Engineering chemistry.chemical_element Mineralogy Microstructure Copper law.invention Nickel chemistry Etching (microfabrication) law Electrochemistry Composite material Photolithography Electroplating
Zdroj:	Electrochimica Acta. 49:945-950
ISSN:	0013-4686
Popis:	Three-dimensional (3D) microstructures were formed using a wet process consisting of the formation of a multilayered microstructure and selective etching of the other layers of the structure. Cylindric Cu/Ni multilayered microstructures of 50 μm in diameter and 30 μm in height were formed by electroplating and photolithography. Cu layers were then etched selectively in acidic thiourea solution. The redox reaction of the multilayered microstructure in the solution was investigated electrochemically. The shapes of three-dimensional microstructures were affected by the surface morphology of the deposited films. Various three-dimensional microstructures having controlled geometric unevenness were obtained using films having smooth surface morphology.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::c7f25042a17ca231d3463f3719760dba https://doi.org/10.1016/j.electacta.2003.10.006 Zobrazit plný text záznamu Full Text from ScienceDirect