Creation of high-aspect-ratio microchannels inside silicon with three-dimensional laser lithography
Autor: | Muhammad Ahsan Tauseef, Rana Asgari Sabet, Onur Tokel |
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Rok vydání: | 2022 |
Zdroj: | Conference on Lasers and Electro-Optics. |
Popis: | Here, we demonstrate for the first-time, high-aspect-ratio microchannels inside silicon wafers, exploiting modulated lasers beams. The optical quality of the top wafer surface is preserved for further on-chip, in-chip integration. |
Databáze: | OpenAIRE |
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