Creation of high-aspect-ratio microchannels inside silicon with three-dimensional laser lithography

Autor: Muhammad Ahsan Tauseef, Rana Asgari Sabet, Onur Tokel
Rok vydání: 2022
Zdroj: Conference on Lasers and Electro-Optics.
Popis: Here, we demonstrate for the first-time, high-aspect-ratio microchannels inside silicon wafers, exploiting modulated lasers beams. The optical quality of the top wafer surface is preserved for further on-chip, in-chip integration.
Databáze: OpenAIRE