Autor: |
Jian Guo Cao, Yongbo Wu, Hui Ru Guo, Ya Guo Li, Masakazu Fujimoto, Masaaki Kemmochi, Libo Zhou |
Rok vydání: |
2012 |
Předmět: |
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Zdroj: |
Key Engineering Materials. :155-160 |
ISSN: |
1662-9795 |
DOI: |
10.4028/www.scientific.net/kem.523-524.155 |
Popis: |
Ultrasonic vibration assisted processing is well known for the improvement in machined surface quality and processing efficiency due to the reduced forces and tribology-generated heating when grinding hard-brittle materials. We transplanted this philosophy to chemo-mechanical fixed abrasive polishing of optical glass, namely fused silica, in an attempt to improve surface roughness and/or material removal rate. Experiments were conducted to elucidate the fundamental characteristics of chemo-mechanical fixed abrasive polishing of fused silica in the presence and absence of ultrasonic vibration on a setup with an in-house built gadget. The experimental results show that ultrasonic vibration assisted chemo-mechanical fixed abrasive polishing can yield increased material removal rate while maintaining the surface roughness of manufactured optics compared to conventional fixed abrasive polishing without ultrasonic vibration. The mechanism of material removal in fixed abrasive polishing was also delved. We found that the glass material is removed through the synergic effects of chemical and mechanical actions between abrasives and glass and the resultant grinding swarf contains ample Si element as well as Ce element, standing in stark contrast to the polisher that contains abundant Ce element and minor Si element. |
Databáze: |
OpenAIRE |
Externí odkaz: |
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