Estimation of Maximum Operating Temperature for Cu Wire Bonds: Comparison of Epoxy and Silicone Encapsulant Types
Autor: | Stevan Hunter, Michael Mayer, Michael David Hook |
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Rok vydání: | 2018 |
Předmět: |
010302 applied physics
Arrhenius equation Work (thermodynamics) Materials science Failure probability Extrapolation Thermodynamics Time data Epoxy 01 natural sciences 010305 fluids & plasmas symbols.namesake chemistry.chemical_compound Silicone chemistry Operating temperature visual_art 0103 physical sciences visual_art.visual_art_medium symbols |
Zdroj: | 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC). |
Popis: | To add to the knowledge of high-temperature reliability of Cu wire Bonds, this work reports a method and data for the estimation of maximum operating temperature levels for various Cu wire and encapsulant combinations. An accelerated failure time model Based on the Arrhenius equation was used to describe the dependence of the degradation times on the aging temperature and to recommend maximum operating temperature values. Failure was defined as +10 % resistance change. However, due to time constraints, insufficient failure time data was available for model fitting using this failure criterion. Instead, models were fit using a failure criterion of 1 % resistance increase, then extrapolated to the original failure criterion, assuming a linear rate of resistance increase. Using this extrapolation, it was estimated that to keep the failure probability below 1 ppm, the recommended maximum operating temperature levels for a standard lifetime of 12 kilo-hours with PCC wire are $163 \circ \mathrm {c}, 145 \circ \mathrm {c}$, and $141 \circ \mathrm {c}$ for encapsulants air, epoxy, and silicone, respectively. Corresponding maximum temperatures for bare Cu wire are $159^{\circ }\mathrm {C}$ and $125^{\circ }\mathrm {C}$ for epoxy and silicone, respectively. Bare Cu wire in air had poor reliability at $225 \circ \mathrm {c}$ and so was not tested at $200^{\circ }\mathrm {C}$ or $175^{\circ }\mathrm {C}.$ |
Databáze: | OpenAIRE |
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