Hexagonal boron nitride/polymethyl-vinyl siloxane rubber dielectric thermally conductive composites with ideal thermal stabilities
Autor: | Yang Li, Junwei Gu, Xudong Meng, Qiang Zhuang, Jie Kong, Yusheng Tang |
---|---|
Rok vydání: | 2017 |
Předmět: |
Materials science
02 engineering and technology Dielectric 010402 general chemistry 01 natural sciences law.invention chemistry.chemical_compound Magazine Natural rubber law Ultimate tensile strength Microelectronics Composite material business.industry 021001 nanoscience & nanotechnology 0104 chemical sciences chemistry Mechanics of Materials Siloxane visual_art Volume fraction Ceramics and Composites visual_art.visual_art_medium Dielectric loss 0210 nano-technology business |
Zdroj: | Composites Part A: Applied Science and Manufacturing. 92:27-32 |
ISSN: | 1359-835X |
Popis: | Hexagonal boron nitride/polymethyl-vinyl siloxane rubber (hBN/VMQ) dielectric thermally conductive composites were fabricated via kneading followed by hot compression method. The thermally conductive coefficient (λ), thermal diffusion coefficient (α), dielectric constant (e) and dielectric loss tangent (tan δ) values were all increased with the increasing addition of hBN fillers. When the volume fraction of hBN fillers was 40 vol%, the corresponding λ and α was 1.110 W/m K and 1.174 mm2/s, 6 and 9 times than that of pure VMQ matrix, respectively. The corresponding e and tan δ was 3.51 and 0.0054, respectively. Furthermore, the tensile strength and THeat-resistance index (THRI) values were both maximum with 20 vol% hBN fillers, tensile strength of 3.31 MPa, 12 times than that of pure VMQ matrix (0.28 MPa), and THRI of 253.8 °C. The obtained hBN/VMQ composites present great potential for packaging in continuous integration and miniaturization of microelectronic devices. |
Databáze: | OpenAIRE |
Externí odkaz: |