Tailoring Copper Island Density for Copper Plating on a RuTa Substrate

Autor:	Katrien Strubbe, Magi Margalit Nagar, A. Radisic, Philippe M. Vereecken
Rok vydání:	2010
Předmět:	chemistry Plating Metallurgy Alloy engineering Copper plating Nucleation chemistry.chemical_element Substrate (chemistry) engineering.material Electrochemistry Copper Deposition (law)
Zdroj:	ECS Transactions. 28:9-16
ISSN:	1938-6737 1938-5862
DOI:	10.1149/1.3502439
Popis:	The electrochemical nucleation and growth of copper on a ruthenium-tantalum (RuTa) alloy has been studied using galvanostatic methods. The experimental results show that the island density is highly dependent on the bath composition and deposition parameters. High island density was achieved with higher applied current, addition of suppressor and low copper concentration in the plating bath.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::c72c7f18894b79636d8fcdda76953bab https://doi.org/10.1149/1.3502439 Zobrazit plný text záznamu