Silicon microcavities fabricated with a new technique

Autor:	L. Tenerz, B. Hök
Rok vydání:	1986
Předmět:	Materials science Fabrication Silicon business.industry chemistry.chemical_element Nanotechnology Isotropic etching Semiconductor chemistry Etching (microfabrication) Microelectronics Electrical and Electronic Engineering Thin film business Lithography
Zdroj:	Electronics Letters. 22:615-616
ISSN:	1350-911X
DOI:	10.1049/el:19860418
Popis:	A new fabrication technique for silicon microcavities is described. The technique makes use of lithographic patterning and etching techniques, high-temperature bonding between hydrated surfaces and selective etching. Cavities with dimensions 100 × 250 × 12 ?m and with a confining membrane consisting of a 1 ?m-thick SiO2, film are demonstrated. The technique is potentially totally IC-compatible and can be used to realise a variety of sensor and actuator structures.
Databáze:	OpenAIRE
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