Dielectric Breakdown Strength of SiO2 Using a Stepped‐Field Method
| Autor: | Eric A. Sprangle, Martin C. Peckerar, John M. Andrews |
|---|---|
| Rok vydání: | 1992 |
| Předmět: |
chemistry.chemical_classification
Dielectric strength Field (physics) Renewable Energy Sustainability and the Environment Oxide Mineralogy Condensed Matter Physics Surfaces Coatings and Films Electronic Optical and Magnetic Materials law.invention Stress (mechanics) Capacitor chemistry.chemical_compound chemistry law Materials Chemistry Electrochemistry Thin film Current (fluid) Composite material Inorganic compound |
| Zdroj: | Journal of The Electrochemical Society. 139:2617-2620 |
| ISSN: | 1945-7111 0013-4651 |
| DOI: | 10.1149/1.2221274 |
| Popis: | The ramped-field technique has been widely used for determining dielectric breakdown in thin insulating films. But this method does not control stress time, and it is difficult to define an irreversibly broken down capacitor based solely on observations of current during stressing. A more advanced stepped-field method is described, which provides well-defined stress times and guarantees catastrophic breakdown in all cases. MOS capacitors, formed by depositing Al dots on thermally grown SiO 2 , were used to determine oxide breakdown. The breakdown field was found to decrease logarithmically with the stressing time |
| Databáze: | OpenAIRE |
| Externí odkaz: |
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