Optimization of spaceflight millimeter-wave impedance matching networks using laser trimming
| Autor: | Brian N. Ellison, Simon Rea, P. G. Huggard, Kai Parow-Souchon, M. Merritt, C. Spindloe, Brian Moyna, M. Henry, L. Harman, P. Hunyor, N. Brewster, D. Cuadrado-Calle, P. Sykes |
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| Rok vydání: | 2021 |
| Předmět: |
Materials science
business.industry 020208 electrical & electronic engineering Impedance matching 020206 networking & telecommunications 02 engineering and technology Spaceflight Laser trimming law.invention Optics law Extremely high frequency 0202 electrical engineering electronic engineering information engineering Electrical and Electronic Engineering business |
| Zdroj: | International Journal of Microwave and Wireless Technologies. 14:1-7 |
| ISSN: | 1759-0795 1759-0787 |
| DOI: | 10.1017/s1759078721000180 |
| Popis: | Realizing packaged state-of-the-art performance of monolithic microwave integrated circuits (MMICs) operating at millimeter wavelengths presents significant challenges in terms of electrical interface circuitry and physical construction. For instance, even with the aid of modern electromagnetic simulation tools, modeling the interaction between the MMIC and its package embedding circuit can lack the necessary precision to achieve optimum device performance. Physical implementation also introduces inaccuracies and requires iterative interface component substitution that can produce variable results, is invasive and risks damaging the MMIC. This paper describes a novel method for in situ optimization of packaged millimeter-wave devices using a pulsed ultraviolet laser to remove pre-selected areas of interface circuit metallization. The method was successfully demonstrated through the optimization of a 183 GHz low noise amplifier destined for use on the MetOp-SG meteorological satellite series. An improvement in amplifier output return loss from an average of 12.9 dB to 22.7 dB was achieved across an operational frequency range of 175–191 GHz and the improved circuit reproduced. We believe that our in situ tuning technique can be applied more widely to planar millimeter-wave interface circuits that are critical in achieving optimum device performance. |
| Databáze: | OpenAIRE |
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