Syntactic Foams for Filling Sealing Compositions Based on Epoxy Resin and Hollow Phenol-Formaldehyde Microspheres
| Autor: | V. Yu. Chukhlanov, E. E. Mastalygina, N. V. Chukhlanova, O. G. Selivanov |
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| Rok vydání: | 2020 |
| Předmět: |
010407 polymers
Materials science Polymers and Plastics Syntactic foam General Chemical Engineering Sealant Formaldehyde General Chemistry Adhesion Epoxy 010402 general chemistry 01 natural sciences 0104 chemical sciences Microsphere chemistry.chemical_compound chemistry visual_art visual_art.visual_art_medium Phenol Dielectric loss Composite material |
| Zdroj: | Polymer Science, Series D. 13:241-244 |
| ISSN: | 1995-4220 1995-4212 |
| DOI: | 10.1134/s1995421220030053 |
| Popis: | Physicomechanical, thermophysical, and electrical properties of syntactic foams based on ED-20 epoxy diane resin and hollow phenol-formaldehyde microspheres have been considered. The optimal amount of microspheres in the composition has been determined. It has been shown that hollow microspheres affect the adhesion and strength characteristics of the sealant and reduce the dielectric loss tangent in the centimeter UHF range, which allows one to recommend such syntactic foams as sealing compositions in radioelectronic equipment and antenna-feeder devices operating in the ultra-high-frequency radio range. |
| Databáze: | OpenAIRE |
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