Signal integrity simulation and analysis in high-speed interconnects by using FDTD
| Autor: | Yuan Wei-liang, Li Er-ping |
|---|---|
| Rok vydání: | 2003 |
| Předmět: |
Interconnection
Signal processing Engineering business.industry Circuit design Electrical engineering Electromagnetic compatibility Hardware_PERFORMANCEANDRELIABILITY Electromagnetic interference EMI Hardware_INTEGRATEDCIRCUITS Electronic engineering Computational electromagnetics Signal integrity business |
| Zdroj: | 2002 3rd International Symposium on Electromagnetic Compatibility. |
| DOI: | 10.1109/elmagc.2002.1177422 |
| Popis: | With the advancements in microelectronics, interest in electromagnetic interference and compatibility in high-speed circuits has greatly increased in the engineering community, and applications of computational electromagnetics to electromagnetic interference and compatibility (EMI/EMC) engineering become an emerging technology. Termination, via, and crosstalk on interconnection lines will raise EMI problems in high-speed circuits and will therefore require more attention during the design phase for signal integrity. This paper presents signal propagation effect analysis on high-speed interconnection lines, between different parts, with the finite-difference time-domain method. The mechanisms and effectiveness of control measures are examined, which could be applied to high-speed circuit design. |
| Databáze: | OpenAIRE |
| Externí odkaz: |
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