When are transmission-line effects important for on-chip interconnections?
| Autor: | Barry J. Rubin, Robert H. Dennard, Wiren D. Becker, T. Gallo, L.M. Terman, R.P. Dunne, Howard H. Smith, Phillip J. Restle, George A. Katopis, D.R. Knebel, Gerard V. Kopcsay, George Anthony Sai-Halasz, Paul W. Coteus, C.W. Surovic, Alina Deutsch, Byron L. Krauter, Keith A. Jenkins |
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| Rok vydání: | 1997 |
| Předmět: |
Capacitive coupling
Resistive touchscreen Engineering Radiation Busbar business.industry Electrical engineering Hardware_PERFORMANCEANDRELIABILITY Condensed Matter Physics Inductive coupling Capacitance Inductance Electric power transmission Transmission line Hardware_INTEGRATEDCIRCUITS Electronic engineering Electrical and Electronic Engineering business Hardware_LOGICDESIGN |
| Zdroj: | IEEE Transactions on Microwave Theory and Techniques. 45:1836-1846 |
| ISSN: | 0018-9480 |
| DOI: | 10.1109/22.641781 |
| Popis: | Short, medium, and long on-chip interconnections having linewidths of 0.45-52 /spl mu/m are analyzed in a five-metal-layer structure. We study capacitive coupling for short lines, inductive coupling for medium-length lines, inductance and resistance of the current return path in the power buses, and line resistive losses for the global wiring. Design guidelines and technology changes are proposed to achieve minimum delay and contain crosstalk for local and global wiring. Conditional expressions are given to determine when transmission-line effects are important for accurate delay and crosstalk prediction. |
| Databáze: | OpenAIRE |
| Externí odkaz: |
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