Thermal Stress Measurement in Silicon Chips Encapsulated in IC Plastic Packages Under Temperature Cycling

Autor:	Asao Nishimura, Makoto Kitano, Sueo Kawai, Hideo Miura
Rok vydání:	1993
Předmět:	Stress (mechanics) Steady state (electronics) Materials science Silicon chemistry Mechanics of Materials chemistry.chemical_element Molding (process) Temperature cycling Electrical and Electronic Engineering Composite material Computer Science Applications Electronic Optical and Magnetic Materials
Zdroj:	Journal of Electronic Packaging. 115:9-15
ISSN:	1528-9044 1043-7398
DOI:	10.1115/1.2909307
Popis:	Thermal stress in silicon chips encapsulated in IC plastic packages is discussed. A stress-sensing chip which can detect the three-dimensional stress components separately is developed. Thermal stress occurs in the silicon chip almost linearly with temperature at the steady state. The stress path with temperature during heating is the same as that during cooling. On the other hand, during temperature cycling, stress hysteresis is observed, and the stress increases gradually with increasing cycles. The stress increase phenomenon occurs due to the viscoelastic phenomenon of the molding compounds. The stress-increase ratio is determined by the relationship between the cycle period and the stress relaxation time of the molding compounds at temperatures of interest.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::c5f9f274ce709801ffd614e765a72465 https://doi.org/10.1115/1.2909307 Zobrazit plný text záznamu