Comparison of hot embossing micro structures with and without ultrasound
| Autor: | Johannes Sackmann, Wei Zou, Matthias Worgull, Werner Karl Schomburg, Andreas Striegel |
|---|---|
| Rok vydání: | 2019 |
| Předmět: |
Materials science
02 engineering and technology medicine.disease_cause Curvature 01 natural sciences Mold 0103 physical sciences medicine Hot embossing Electrical and Electronic Engineering Composite material Shrinkage 010302 applied physics chemistry.chemical_classification business.industry Ultrasound Process (computing) Polymer Energy consumption 021001 nanoscience & nanotechnology Condensed Matter Physics Electronic Optical and Magnetic Materials chemistry Hardware and Architecture 0210 nano-technology business |
| Zdroj: | Microsystem Technologies. 25:4185-4195 |
| ISSN: | 1432-1858 0946-7076 |
| DOI: | 10.1007/s00542-019-04469-1 |
| Popis: | Hot embossing with and without ultrasound are compared in this paper with respect to several properties of the fabricated samples. The same mold was employed for both processes and process parameters have been chosen adapted to each process such that to the best knowledge of the authors good moldings were achieved. Shrinkage is similar for both processes. Better mold filling is achieved without ultrasound and the polymer structures correspond better to the mold after demolding. Undesired sample curvature is also much less. With ultrasound required investment costs and energy consumption are significantly less, and the cycle time is reduced to seconds. |
| Databáze: | OpenAIRE |
| Externí odkaz: |
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