Advanced thick film system for AlN substrates
| Autor: | R. J. Bacher, D. K. Anderson, A. F. Carroll, J. D. Smith, Christopher R. Needes, Y. L. Wang, Yong Soo Cho, J. C. Crumpton |
|---|---|
| Rok vydání: | 2003 |
| Předmět: |
Engineering
Beryllium oxide business.industry Aluminium nitride Electrical engineering Dielectric Substrate (printing) Condensed Matter Physics Automotive electronics Engineering physics Atomic and Molecular Physics and Optics Surfaces Coatings and Films Electronic Optical and Magnetic Materials law.invention chemistry.chemical_compound Thermal conductivity chemistry law Electrical and Electronic Engineering Resistor business Electrical conductor |
| Zdroj: | Microelectronics International. 20:48-51 |
| ISSN: | 1356-5362 |
| DOI: | 10.1108/13565360310455535 |
| Popis: | Substrates with high thermal conductivity continue to be in great demand for their ability to enable smaller and denser high power circuits. BeO has been used for this purpose for many years with thick film materials. However, due to health and environmental concerns with BeO, many manufacturers feel compelled to switch to alternative substrates. This paper will discuss a thick film system consisting of conductors, dielectric, and resistors developed specifically for use with the most likely alternative, AlN substrates. This system will soon find broad use in applications such as power resistors for telecom, optoelectronic submounts, and high‐power automotive applications. |
| Databáze: | OpenAIRE |
| Externí odkaz: |
|