| Autor: |
Y. Ma, K. Kalaiazhagan, Satish Kodali, C. Zhang, T. Vijay, Felix Beaudoin, C.-K. Oh, T. Schaeffer, J. Yu, Donald Nedeau, S. Arva |
| Rok vydání: |
2016 |
| Předmět: |
|
| Zdroj: |
International Symposium for Testing and Failure Analysis. |
| ISSN: |
0890-1740 |
| DOI: |
10.31399/asm.cp.istfa2016p0249 |
| Popis: |
Conductive thin film residues often referred to as puddles could be challenging fails to detect. A large extant film with no distinct boundaries would make the task more challenging for a comparison between good and bad region. Advanced node 20nm and 14nm technologies mandate use of several conductive thin films in the front end of line processes, and hence a potential for high defects during initial product development stage. Use of other electrical characterization techniques in combination with scanning electron microscopy inspection will be a very powerful tool to detect the root cause affirmatively. Cross-sectional images are necessary to understand the root cause of the fails for corrective actions. This work uses three cases of power supply shorts as a platform to demonstrate the idea, demonstrating a few situations where traditional techniques might reach its limits while the authors depend on additional characterization tools to confidently detect and confirm fails. |
| Databáze: |
OpenAIRE |
| Externí odkaz: |
|
