Study on the Mechanical Bend Fatigue of Micro-Joining Soldered Joint with Lead-Free Solder

Autor: Fang Juan Qi, Li Xing Huo, Ya Ping Ding, Zhan Lai Ding
Rok vydání: 2007
DOI: 10.4028/0-87849-456-1.2573
Databáze: OpenAIRE