| Autor: |
Knowlton Olmstead, Curtis Zwenger, Richard Strode |
| Rok vydání: |
2021 |
| Zdroj: |
International Symposium on Microelectronics. 2021:000207-000211 |
| ISSN: |
1085-8024 |
| DOI: |
10.4071/1085-8024-2021.1.000207 |
| Popis: |
Increasing demands for storage and high-performance memory in applications such as artificial intelligence (AI), machine learning and processing storage are driving long-term growth in the market. This paper will highlight the key challenges encountered in packaging next-generation memory devices and discuss some of the technological developments required to address them while considering performance, cost, and yield. An evaluation is highlighted of a remote microwave plasma process to remove damage caused by laser ablation during the wafer dicing process that shows an improvement in die strength using this process. |
| Databáze: |
OpenAIRE |
| Externí odkaz: |
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