Optoelectronic packaging technology development of a high density 32-channel 16 Gbps optical data link for the optoelectronic technology consortium (OETC)

Autor:	B.H. Tyrone, Yiu-Man Wong, W.J. Parzygnat, D.J. Muehlner, P.J. Anthony, C.C. Faudskar, J.V. Gates
Rok vydání:	2002
Předmět:	3D optical data storage Materials science Packaging engineering Silicon chemistry business.industry Optoelectronics High density chemistry.chemical_element Link (geometry) business Communication channel
Zdroj:	Proceedings of LEOS'94.
Popis:	Summary form only given. A parallel, 32 channel, high density (140 /spl mu/m pitch) 500 Mbps/channel NRZ optical data link has been successfully fabricated using existing GaAs IC, silicon optical bench, and multichip module technologies. Packaging designs, its implementation, and link characterization will be discussed.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::c3d457bb474a3ed8032efa1b0c571d74 https://doi.org/10.1109/leos.1994.586972 Zobrazit plný text záznamu