Investigation into the buffer-layer effect on the phase formation in Au80Sn20 thin film solder obtained by electron-beam deposition technique

Autor: I. V. Chemagina, O. V. Titova, E. M. Filonenko, A. V. Fomin
Rok vydání: 2019
Předmět:
Zdroj: Journal of Physics: Conference Series. 1281:012017
ISSN: 1742-6596
1742-6588
Popis: In this work, differential scanning calorimetry (DSC) and X-ray microanalysis are used to investigate Ti and Ti/Pt buffer-layer effect on the eutectic formation in 1μm Au80Sn20 thin film solder obtained by electron-beam deposition of gold tin alternating layers.
Databáze: OpenAIRE