Investigation into the buffer-layer effect on the phase formation in Au80Sn20 thin film solder obtained by electron-beam deposition technique
Autor: | I. V. Chemagina, O. V. Titova, E. M. Filonenko, A. V. Fomin |
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Rok vydání: | 2019 |
Předmět: | |
Zdroj: | Journal of Physics: Conference Series. 1281:012017 |
ISSN: | 1742-6596 1742-6588 |
Popis: | In this work, differential scanning calorimetry (DSC) and X-ray microanalysis are used to investigate Ti and Ti/Pt buffer-layer effect on the eutectic formation in 1μm Au80Sn20 thin film solder obtained by electron-beam deposition of gold tin alternating layers. |
Databáze: | OpenAIRE |
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