An overview of CMOS VLSI failure analysis and the importance of test and diagnostics

Autor:	David P. Vallett
Rok vydání:	2002
Předmět:	Very-large-scale integration Engineering Diagnostic methods Software business.industry Process (computing) Electronic engineering Cmos vlsi Adaptation (computer science) business Electron beam testing Die (integrated circuit)
Zdroj:	ITC
DOI:	10.1109/test.1996.557160
Popis:	This paper reviews the logic failure analysis process and the critical need for design-for-diagnostics. The use of flip-chip packaging will render hardware-based diagnostic techniques from the front side of the die obsolete, e.g., liquid crystal, electron beam testing, and photon emission microscopy. Two primary solutions are discussed: software-based diagnostic methods, e.g., scan, and the adaptation of hardware techniques to the backside of the die.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::c32b7afc754f93193aa1205c14c50ccf https://doi.org/10.1109/test.1996.557160 Zobrazit plný text záznamu