Hybrid Systems in Foil (HySiF) exploiting ultra-thin flexible chips
| Autor: | Stefan Saller, Jan Kostelnik, Enno Lorenz, Andreas Kugler, Alina Schreivogel, Zili Yu, Joachim N. Burghartz, Christine Harendt |
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| Rok vydání: | 2015 |
| Předmět: |
Engineering
Fabrication business.industry ComputingMethodologies_IMAGEPROCESSINGANDCOMPUTERVISION Condensed Matter Physics Flexible electronics Electronic Optical and Magnetic Materials Printed electronics Component (UML) visual_art Hybrid system Electronic component Materials Chemistry Electronic engineering visual_art.visual_art_medium Electronics Electrical and Electronic Engineering business FOIL method |
| Zdroj: | Solid-State Electronics. 113:101-108 |
| ISSN: | 0038-1101 |
| DOI: | 10.1016/j.sse.2015.05.023 |
| Popis: | Electronics embedded in foil is an enabling technology for flexible electronics and for special form factors of electronic components. In contrast to strictly printed electronics, Hybrid Systems-in-Foil (HySiF), comprising thin flexible, embedded chips and large-area thin-film electronic elements, feature a versatile and reliable technological solution for industrial applications of flexible electronics. This paper provides a comprehensive overview of HySiF technology, including aspects of thin-chip fabrication, reliability and assembly. Also presented is an industrial demonstrator utilizing such a HySiF component. |
| Databáze: | OpenAIRE |
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