Strain-measurement methods as a forecasting factor for the behavior of semiconductor thermoelements under extreme temperatures

Autor:	E. K. Iordanishvili, Kh. O. Olimov, Yu. I. Ravich
Rok vydání:	1987
Předmět:	Materials science Mathematical model business.industry Mechanical Engineering General Chemical Engineering General Engineering Strain measurement Mechanics Condensed Matter Physics Thermoelectric materials Piezoelectricity Thermal expansion Semiconductor Shear (geology) Shear stress business
Zdroj:	Journal of Engineering Physics. 53:780-782
ISSN:	1573-871X 0022-0841
DOI:	10.1007/bf00874036
Popis:	Strain effects, arising owing to shear stresses in a thermoelement with low branches, are studied.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::c2f8f8f5db0d6a29fcdbef1a8ea3375c https://doi.org/10.1007/bf00874036 Zobrazit plný text záznamu Full text from SpringerLink