Dynamic EFI and circuit analysis case studies on integrated circuit buried via void defects

Autor:	M.H. Thor, B.L. Yeoh, S.H. Goh, L.S. Gan, Y.H. Chan
Rok vydání:	2022
Předmět:	Electrical and Electronic Engineering Safety Risk Reliability and Quality Condensed Matter Physics Atomic and Molecular Physics and Optics Surfaces Coatings and Films Electronic Optical and Magnetic Materials
Zdroj:	Microelectronics Reliability. 135:114569
ISSN:	0026-2714
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::c28b3a34cba7016a4c9ae6a2a091280e https://doi.org/10.1016/j.microrel.2022.114569 Zobrazit plný text záznamu Full Text from ScienceDirect