Crosstalk study of high speed on-package interconnects for multi-chip package

Autor:	Louis Lo, Jackson Chung Peng Kong, Khang Choong Yong, Bok Eng Cheah, Po Yin Yaw
Rok vydání:	2014
Předmět:	Crosstalk Computer science business.industry Electronic engineering Electrical engineering Chip business
Zdroj:	2014 IEEE International Symposium on Electromagnetic Compatibility (EMC).
DOI:	10.1109/isemc.2014.6899001
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::c2071f50917288becd672939d0895a3a https://doi.org/10.1109/isemc.2014.6899001 Zobrazit plný text záznamu