Dimensional Parameters Controlling Capillary Underfill Flow for Void-Free Encapsulation of a Direct Bonded Heterogeneous Integration (DBHi) Si-bridge Package

Autor:	Chinami Marushima, Toyohiro Aoki, Koki Nakamura, Risa Miyazawa, Akihiro Horibe, Isabel de Sousa, Kamal Sikka, Takashi Hisada
Rok vydání:	2022
Zdroj:	2022 IEEE 72nd Electronic Components and Technology Conference (ECTC).
DOI:	10.1109/ectc51906.2022.00098
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::c1fdd11e759e97dc5403aef037e0a182 https://doi.org/10.1109/ectc51906.2022.00098 Zobrazit plný text záznamu