Influences of Cleaning Conditions and Elapse after Etch on Via Resistance in Multi-Level Cu Interconnects

Autor:	Kwang Myeon Park, Sang Rok Hah, Chan Geun Park, Jeff Barnes, Ju Hyuk Chung, Byung Lyul Park, Uk Sun Hong, Hong Seong Son, Jun Hwan Oh
Rok vydání:	2003
Předmět:	Materials science Metallurgy General Materials Science Condensed Matter Physics Atomic and Molecular Physics and Optics
Zdroj:	Solid State Phenomena. 92:259-262
ISSN:	1662-9779
DOI:	10.4028/www.scientific.net/ssp.92.259
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::c1d2065db41fbdecba023eea48b0ef58 https://doi.org/10.4028/www.scientific.net/ssp.92.259 Zobrazit plný text záznamu