Relationship between cross-linking conditions of ethylene vinyl acetate and potential induced degradation for crystalline silicon photovoltaic modules
| Autor: | Sachiko Jonai, Tsutsui Yuji, Atsushi Masuda, Hidenari Nakahama, Kohjiro Hara |
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| Rok vydání: | 2015 |
| Předmět: |
Materials science
Physics and Astronomy (miscellaneous) General Engineering General Physics and Astronomy Ethylene-vinyl acetate Dynamic mechanical analysis Potential induced degradation chemistry.chemical_compound Differential scanning calorimetry Electrical resistance and conductance chemistry otorhinolaryngologic diseases Vinyl acetate sense organs Crystalline silicon Composite material Curing (chemistry) |
| Zdroj: | Japanese Journal of Applied Physics. 54:08KG01 |
| ISSN: | 1347-4065 0021-4922 |
| DOI: | 10.7567/jjap.54.08kg01 |
| Popis: | In this study, we investigated the relationship in crystalline silicon (c-Si) photovoltaic (PV) modules between the cross-linking level of copolymer of ethylene and vinyl acetate (EVA) as the encapsulant and the degree of degradation due to potential induced degradation (PID) phenomenon. We used three methods for the determination of cross-linking level of EVA: xylene method, which is one of the solvent extraction methods (SEM), curing degree by differential scanning calorimetry (DSC), and viscoelastic properties by dynamic mechanical analysis (DMA). The results indicate that degradation of PV modules by PID test depends on the cross-linking level of EVA. The PV modules encapsulated by EVA with higher cross-linking level show lower degradation degree due to PID phenomenon. Also we showed that EVA with higher cross-linking level tended to be higher volume resistivity. This tendency is similar to that for electrical resistance value during the PID test. The PID test was also done by changing thickness of EVA between front cover glass and c-Si with the same cross-linking level. The PV modules encapsulated by thicker EVA between front cover glass and c-Si cell show lower degradation by PID. From these results, the PV modules encapsulated by EVA with higher cross-linking level, higher volume resistivity and increased thickness would be tolerant of PID phenomenon. |
| Databáze: | OpenAIRE |
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