Development of an assembly process and reliability investigations for flip-chip LEDs using the AuSn soldering
| Autor: | Hermann Oppermann, R. Aschenbrenner, E. Jäger, H. Reichl, G. Elger, M. Hutter |
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| Rok vydání: | 2002 |
| Předmět: |
Interconnection
Materials science Silicon business.industry Electronic packaging chemistry.chemical_element Condensed Matter Physics Electronic Optical and Magnetic Materials law.invention chemistry Hardware and Architecture law Soldering Optoelectronics Wafer Electrical and Electronic Engineering business Electroplating Flip chip Light-emitting diode |
| Zdroj: | Microsystem Technologies. 7:239-243 |
| ISSN: | 1432-1858 0946-7076 |
| DOI: | 10.1007/s005420100103 |
| Popis: | A packaging process for flip-chip LEDs (light emitting diodes) is described. The LEDs are picked and placed on a silicon substrate wafer. After reflow the substrates are individualized. AuSn solder is used for the interconnection. The solder compounds, Au and Sn, are electroplated separately: Sn on the silicon substrate and Au on the chip. The interconnections formed by tin-rich and by gold-rich intermetallic phases are compared. The metallurgy and the reliability of the LEDs are investigated. The superiority of the gold-rich interconnection is demonstrated. |
| Databáze: | OpenAIRE |
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