Recent Advances of Conductive Adhesives: A Lead-Free Alternative in Electronic Packaging

Autor:	Grace Y. Li, C.P. Wong
Rok vydání:	2007
Předmět:	Materials science Lead (geology) Contact resistance Electronic packaging Electrically conductive adhesive Anisotropic conductive film Adhesive Composite material Electrical conductor
Zdroj:	Micro-and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging ISBN: 9780387279749
DOI:	10.1007/0-387-32989-7_42
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::c145032a4e043db0990a3607380b2b6b https://doi.org/10.1007/0-387-32989-7_42 Zobrazit plný text záznamu