Quantification of free convection within a hemispherical annulus through a porous medium saturated by water-copper nanofluid
| Autor: | Abderrahmane Baïri, Nagaraj Suresh, Palanisamy Gayathri, Purusothaman Abimanyu, N. Nithyadevi |
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| Rok vydání: | 2019 |
| Předmět: |
Materials science
Natural convection Convective heat transfer Applied Mathematics Mechanical Engineering 02 engineering and technology Mechanics Rayleigh number 021001 nanoscience & nanotechnology Nusselt number Computer Science Applications 020303 mechanical engineering & transports Nanofluid 0203 mechanical engineering Mechanics of Materials Heat transfer Annulus (firestop) 0210 nano-technology Porous medium |
| Zdroj: | International Journal of Numerical Methods for Heat & Fluid Flow. 29:1153-1166 |
| ISSN: | 0961-5539 |
| Popis: | Purpose A porous medium saturated with a nanofluid based on pure water and copper nanoparticles is used for cooling a hemispherical electronic device contained in an annulus space. The disc of the cavity could be inclined at an angle ranging from 0 ° (horizontal disc with dome facing upwards) to 180° (horizontal disc with dome facing downwards). The important surface heat flux generated by the dome leads to high Rayleigh number values reaching 7.29 × 10^10. The purpose of this work is to examine the influence of the nanofluid saturated porous medium on the free convective heat transfer. Design/methodology/approach Heat transfer occurring between this active component and the isothermal passive cupola is quantified by means of a three-dimensional numerical study using the control volume method associated to the SIMPLE algorithm. Findings The work shows that heat transfer in the annulus space is improved by interposing a porous medium saturated with the water-copper nanofluid. Originality/value New correlation is proposed to calculate the Nusselt number for any combination of the inclination angle, the fraction volume, the Rayleigh number and the ratio between the thermal conductivities of the porous medium and the fluid. The wide ranges corresponding to these parameters allow the thermal design of this electronic equipment for various configurations. |
| Databáze: | OpenAIRE |
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