A Critical Review and Perspective on Thermal Management of Power Electronics Modules for Inverters and Converters

Autor: Gautam Ghaisas, Shankar Krishnan
Rok vydání: 2021
Předmět:
Zdroj: Transactions of the Indian National Academy of Engineering. 7:47-60
ISSN: 2662-5423
2662-5415
DOI: 10.1007/s41403-021-00268-1
Popis: A cooling technology roadmap is defined for power electronics modules such as insulated gate bipolar transistors (IGBT) and wideband gap semiconductor modules (SiC/GaN). These power modules are widely used for inverter and converter applications. Cooling technologies studied include natural air cooling, forced air cooling, forced liquid cooling, and thermal management technologies employing phase change. This work reviews the standard modes of failures of power electronics modules. The work helps to understand the thermal resistances at various interfaces in the module stack. The study highlights the importance of using electrothermal models for power loss estimation. Effective thermal management must ensure the power electronics components' junction (die) temperature is within the desired limits. The developed cooling technology roadmap suggests using heat flux at the module base and heat generation per temperature rise in the die as a metric for selecting cooling technology. Further, the review also stresses the importance of junction temperature swings experienced by the die during transient operation.
Databáze: OpenAIRE
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