Tape Interconnection for Silicon Solar Cells with Extended Long-Term Stability
| Autor: | Buddgård, J., Lagerstedt, T., Machirant, A. |
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| Jazyk: | angličtina |
| Rok vydání: | 2017 |
| Předmět: | |
| DOI: | 10.4229/eupvsec20172017-5dv.3.4 |
| Popis: | 33rd European Photovoltaic Solar Energy Conference and Exhibition; 1748-1750 The purpose of this work is to reduce production cost for conventional photovoltaic modules by reducing the amount of silver used in the grid on the photovoltaic cell and simplify the method of interconnection of individual PV cells. A novel method of applying bus bars and interconnecting individual cells into a module is proposed. The new method have the possibility to reduces the amount of silver by 25%. Furthermore, the interconnection of individual cells to a module is simplified, thus making the production less costly and more robust. Finally, soldering can be completed without the use of lead and at a lower temperature (150-160°C) which enables the use of cells featuring advanced temperature sensitive architecture like HIT cells. It is very important to ensure a long lifetime for all PV modules. For the proposed new interconnection method we believe that the most important tests to ensure a long lifetime are the UV-exposure test and the thermal cycling test. To ensure that the proposed interconnection tape do not discolor during the PV module´s lifetime this work will therefor test for extended UV exposure of 100kWh/m². This work will also expose the modules for extended thermal cycle test of up to 600 cycles. Because of the lower process temperature with this novel method the modules should be more robust to thermal cycles. A cross-section analysis with SEM of the interconnection between the tape and the grid fingers will also be conducted and shown in this work. Finally, electro luminescent measurements of the tested modules will be disclosed. |
| Databáze: | OpenAIRE |
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