Nucleation Control and Thermal Aging Resistance of Near-Eutectic Sn-Ag-Cu-X Solder Joints by Alloy Design

Autor:	Jason W. Walleser, Alfred Kracher, J. L. Harringa, Fran Laabs, Iver E. Anderson
Rok vydání:	2009
Předmět:	Materials science Alloy Metallurgy Nucleation engineering.material Condensed Matter Physics Microstructure Electronic Optical and Magnetic Materials Soldering Materials Chemistry engineering Shear strength Electrical and Electronic Engineering Supercooling Embrittlement Eutectic system
Zdroj:	Journal of Electronic Materials. 38:2770-2779
ISSN:	1543-186X 0361-5235
DOI:	10.1007/s11664-009-0936-7
Popis:	Elemental (X) additions to Sn-3.5Ag-0.95Cu (SAC3595) solder were developed with minimal (
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::c0f2f8df5e1cdfae469a6d7c4bcb1b93 https://doi.org/10.1007/s11664-009-0936-7 Zobrazit plný text záznamu Full text from SpringerLink