Origin of the TTV of thin films obtained by temporary bonding ZoneBond® technology

Autor:	Raphael Eleouet, L. Baud, F. Fournel, M. Pellat, L. Vignoud, P. Montméat, M. Zussy, L. Bally, T. Enot, Jerome Dechamp
Rok vydání:	2015
Předmět:	Bonding process Materials science Nanotechnology engineering.material Condensed Matter Physics Electronic Optical and Magnetic Materials Total thickness Grinding Coating Hardware and Architecture engineering Wafer Electrical and Electronic Engineering Thin film Composite material
Zdroj:	Microsystem Technologies. 21:987-993
ISSN:	1432-1858 0946-7076
DOI:	10.1007/s00542-015-2431-9
Popis:	This paper deals with the improvement of the TTV values (Total Thickness Variation) of 300 mm silicon wafers thinned down at 100 μm using the ZoneBond ® (ZoneBond® is registred by Brewer Science Inc.) technology. We have demonstrated that the thin film TTV of the film was mainly driven by the bonding process and was very tolerant towards the coating step. It was also shown that, within the experiment precision, the TTV value was not changed by the grinding thinning process. 8 µm was the best TTV value obtained after the optimization of the bonding parameters.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::c077e6ef95c21e3e580e6bb49f386fbb https://doi.org/10.1007/s00542-015-2431-9 Zobrazit plný text záznamu Full text from SpringerLink