Substrate heating and cooling during magnetron sputtering of copper target
| Autor: | Viktor I. Shapovalov, Vitaliy V. Karzin, A. E. Komlev, Pavel B. Baykov, Anastasia S. Bondarenko |
|---|---|
| Rok vydání: | 2016 |
| Předmět: |
010302 applied physics
Physics Discharge current General Physics and Astronomy chemistry.chemical_element 02 engineering and technology Substrate (electronics) Sputter deposition 021001 nanoscience & nanotechnology 01 natural sciences Copper Outflow rate chemistry Thermocouple 0103 physical sciences Cavity magnetron Composite material 0210 nano-technology Deposition (law) |
| Zdroj: | Physics Letters A. 380:882-885 |
| ISSN: | 0375-9601 |
| DOI: | 10.1016/j.physleta.2015.12.021 |
| Popis: | Heating and cooling processes of the substrate during the DC magnetron sputtering of the copper target were investigated. The sensitive element of a thermocouple was used as a substrate. It was found, that the heat outflow rate from the substrate is lower when the magnetron is turned off rather than when it is turned on. Furthermore, the heating rate, the ultimate temperature, and the heat outflow rate related to the deposition of copper atoms are directly proportional to the discharge current density. |
| Databáze: | OpenAIRE |
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