Influence of rapid solidification on Sn–8Zn–3Bi alloy characteristics and microstructural evolution of solder/Cu joints during elevated temperature aging
| Autor: | Guang-hua Wen, Guo-ji Zhao, Guangmin Sheng |
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| Rok vydání: | 2017 |
| Předmět: |
010302 applied physics
Materials science Metallurgy Alloy Metals and Alloys Intermetallic 02 engineering and technology engineering.material 021001 nanoscience & nanotechnology Geotechnical Engineering and Engineering Geology Condensed Matter Physics Microstructure 01 natural sciences Isothermal process Soldering 0103 physical sciences Materials Chemistry engineering 0210 nano-technology Joint (geology) Dissolution Eutectic system |
| Zdroj: | Transactions of Nonferrous Metals Society of China. 27:234-240 |
| ISSN: | 1003-6326 |
| DOI: | 10.1016/s1003-6326(17)60027-x |
| Popis: | The effects of rapid solidification on the microstructure and melting behavior of the Sn–8Zn–3Bi alloy were studied. The evolution of the microstructural characteristics of the solder/Cu joint after an isothermal aging at 150 °C was also analyzed to evaluate the interconnect reliability. Results showed that the Bi in Sn–8Zn–3Bi solder alloy completely dissolved in the Sn matrix with a dendritic structure after rapid solidification. Compared with as-solidified Sn–8Zn–3Bi solder alloy, the melting temperature of the rapid solidified alloy rose to close to that of the Sn–Zn eutectic alloy due to the extreme dissolution of Bi in Sn matrix. Meanwhile, the adverse effect on melting behavior due to Bi addition was decreased significantly. The interfacial intermetallic compound (IMC) layer of the solder/Cu joint was more compact and uniform. Rapid solidification process obviously depressed the formation and growth of the interfacial IMC during the high-temperature aging and improved the high-temperature stability of the Sn–8Zn–3Bi solder/Cu joint. |
| Databáze: | OpenAIRE |
| Externí odkaz: |
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