Scanning Tunneling Microscopy for Metal Deposition Studies
Autor: | M. A. Schneeweiss, D. M. Kolb |
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Rok vydání: | 1999 |
Předmět: | |
Zdroj: | The Electrochemical Society Interface. 8:26-30 |
ISSN: | 1944-8783 1064-8208 |
DOI: | 10.1149/2.f05991if |
Popis: | Electrolytic metal deposition, particularly from aqueous solution, provides the basis for a number of indispensable industrial applications such as metal winning and refining, metal plating for corrosion protection, and surface finishing. Circuit board manufacturing in microelectronics, in particular, has renewed interest in the research of metal deposition. In addition to its industrial significance, electrodeposition is also of principal interest in regard to its fundamentals, such as, the investigation of electrocrystallization phenomena. |
Databáze: | OpenAIRE |
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